| PART |
Description |
Maker |
| CL31A106KOHNNNE |
Multi Layer Ceramic Capacitor
|
Samsung
|
| CL10F474ZB8NNNC |
Multi-layer Ceramic Capacitor
|
Samsung Electronics
|
| CL10B473KA8NNNC |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CL31B105KBHNNNE |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CL31B472KBCNNNC |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CL31B225KOHNNNE |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CL31A476MPHNNNE |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CL10B104KB8NNNC |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| PS205KVP8.2PF/-2PFR16 PS405KVP1000PF/-10N2200 PS20 |
CAPACITOR, CERAMIC, 0.0000082 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.001 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.000033 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00033 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00039 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00047 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.000047 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00002 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.000022 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.000027 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.000056 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00056 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.0000056 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.0000068 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00012 uF, CHASSIS MOUNT
|
Vishay Intertechnology, Inc.
|
| CI160808-1N0D CI160808-1N2D CI160808-1N5D CI160808 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.15 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| CDR11BP100AGYS CDR11BP101AGYS CDR11BP102AGYS CDR11 |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00075 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.000075 uF, SURFACE MOUNT CHIP
CAP 2200PF 50V 5% X7R SMD-1111 WAFFLE-PAK BASE/BARR/SOLDER MICROWAVE R-MIL-PRF-55681 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0022 uF, SURFACE MOUNT
|
AVX, Corp.
|
|
